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| 品牌 | 其他品牌 | 應用領域 | 電子/電池 |
|---|
| Pitch e(mm) | Ball Count | Package Size | Contac Matrix | Ball Dia.(mm) | Ball Height (mm) | Ball Composition | Part Numbe |
| 0.50 | 163 | 8X11 | 12X18 | 0.30 | 0.22 | Pb-free | 776B4163-101 |
| 0.65 | 154 | 8X10 | 11X14 | 0.30 | 0.20 | Eutectic | 776A3154-101 |
| 209 | 14X14 | 20X20 | 0.35 | 0.185 | Eutecti | 776A3209-501 | |
| 260 | 13X13 | 18X18 | 0.40 | 0.33 | Pb-free | 776A3260-101 | |
| 280 | 13X13 | 19X19 | 0.30 | 0.20 | Eutectic | 776A3280-101 | |
| 336 | 14X14 | 20X20 | 0.35 | 0.185 | Eutectic | 776A3336-501 | |
| DESCRIPTION &ORDERING INFORMATION | MATERIALS &SPECIFICATIONS ·Socket Body:PES,PEI,LCP or Equivalent | ||||||
| ·Contact:Beryllium Copper Alloy ·Contact Plating:Gold | |||||||
| ·Contact Force:10 grams far Eutectic Solder Ball | |||||||
| uct Numb | 17 grams for lead-free Solder Ball | ||||||
| ·Contact Resistance:200 mΩ ·Temperature Rating:150℃ ·Durability:10,000 cycles min. | |||||||